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Acoustic Investigation for Internal Structural Defects in TO-247 and TO-220 Packages


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TO-247 packages, along with TO-220s, are designed for use in high-power, through-hole situations. The package may contain transistors (“TO” stands for “transistor outline”), silicon-controlled rectifiers, or integrated circuits.


This is a companion discussion topic for the original entry at https://eepower.com/test-and-measurement/acoustic-investigation-internal-structural-defects-247-and-220-packages-nordson