“Energy saving” is applied to all power electrical systems and low rated power application is no exception to this. It can be realized to move forward, from no-inverter design to inverter design. In addition, the lightweight and compact size are always a concern for the product design. No heat-sink approach is in the trend. In this article, no heat-sink IPM solution with µIPM-DIP is introduced.
This is a companion discussion topic for the original entry at https://eepower.com/semiconductors/ipm-solution-low-rated-power-application-ipm-dip-cipos-tiny-without-heat-sink