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Thermal Resistance and Capacitance are Critical Parameters of Power Devices


#1

Modern power transistor chips shrink continuously, GaN and SiC chips are by nature even smaller than silicon. Thermal resistance and capacitance are impaired.


This is a companion discussion topic for the original entry at https://eepower.com/passive-components/thermal-resistance-and-capacitance-are-critical-parameters-power-devices-vienna